Plasma etching is a form of plasma processing in which a high-speed stream of plasma is shot (in pulses) at a metal. The atoms of the shot element embed themselves at or just below the surface of the target. The physical properties of the target are modified in the process.

Plasma etching is done to pattern the gate region of the MOS transistors. The following steps make up the plasma etch process: Prepare Chamber Load Wafers Plasma Etch Remove Wafers

plasma processing